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AP/PECVD APCVD Systems Aligner, Stepper and Scanner Coating, Developing, Cleaning Track Hitachi CD SEM ION Implantation system LAM Plasma Etcher Oxidation Diffusion Furnace Plasma Asher Rapid Thermal Processor

AP / PECVD 系统

- Oxide -
- Nitride -
- Tungsten -
- Tungsten Silicide -
- TEOS -
- PSG -

APCVD 系统

- Reduce Wafer Surface Contamination -
- Increase Repeatability of Manufacturing-Process Results -

Aligner, Stepper and Scanner

- Contact Mask Align & Expose -
- G-line, i-line and DUV stepper -
- DUV Scanner -

Coating, Developing, Cleaning Track

- SOG coating -
- Photo Resist Coating -
- Photo Resist Developing -
- Photo Resist Stripping -
- Wafer Cleaning -

Hitachi CD SEM

- Computer-Controlled Stage Drive & Speed -
- Dual Cassette Loading -
- Auto-load to Loader Chamber -
- Arm Type Robot -
- Schottky Emission Type Electron Gun -

离子注入系统

- High Current Implantation -
- Medium Current Implantation -
- High Energy Implantation -

LAM 等离子去胶机

- PE / RIE / TCP Etching -
- PE / RIE / TCP, Oxide / Nitride / Metal Applications -
- Auto / Manual operation -

氧化扩散炉

- Diffusion -
- Annealing -
- Oxide -
- Nitride -
- TEOS -
- BPSG -

等离子去胶机

- Bulk Resist Stripping -
- Implant Resist Stripping -
- Remove Scum -
- Isotropic Etching -
- Coating oxide / nitride etching -
- Surface Cleaning -

快速退火炉

- RTA-Ion implantation annealing -
- RTO-thin oxide -
- RTN nitride -
- Silicidation – titanium silicide -
- Titanium nitride -

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