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Single Wafer Processing / Wet Station


  Wafer Cleaning
  Customized According to Customer Requirements
Single Wafer Processing Wet Station


Spin Coater


Subtrate Diameter: 10 to 125 mm
Spread Process Time: 0.01 to 99.99s (adjustable)
Spread Speed Range: 500 to 3000RPM (adjustable)
Spin Process Time: 0.01 to 99.99 (adjustable)
Spin Speed Range: 1500 to 8000RPM (adjustable)
Maximum Rotation Speed: 8000RPM
Power: 220V, 0.5A, 50Hz
Vacuum: 24 in Hg
Size (Length x Width x Height) : 230 x 270 x 260 mm
Weight: 8kg


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